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By Ricky Lee S.W.

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References Bindra, A. (2000), “Innovative packages maximize MOSFETs’ thermal performance”, Electronic Design, Vol. 47 No. 10, p. 52. B. (1952), “Two edge-bonded elastic wedges of different materials and wedges angles under surface tractions”, Journal of Applied Mechanics, pp. 526-8. E. (1976), Mechanical Metallurgy, McGraw-Hill, New York, NY. S. (1969), “Geometric optimization of controlled collapse interconnections”, IBM Journal of Research and Development, Vol. 13 No. 3, pp. 251-65. Harada, M.

C. Cho, A. Mawer and T. Kaschmiedar from Mototrola for their valuable technical discussions. N. (1985), “Thermal fatigue damage in Pb-In solder interconnections”, Proceedings of the 23rd IEEE International Reliability Physics Symposium, Orlando, FL, March 25-29, pp. 198-205. ASM International (1979), Electronic Materials Handbook, Volume 1, Packaging, Materials Park, OH. C. and Mawer, A. (1996), “Interconnect reliability of a C4/ CBGA at both the chip and board level”, Proceedings of the NEPCON ’96 Conference, San Antonio, TX, pp.

A comparison of the crack area propagation of the single bump barrel and stacked hourglass joints is shown in Figure 11. The results clearly show a faster propagation rate for the single bump barrel joint. [ 30 ] Figure 12 shows typical cross sections of joints that failed by thermal fatigue. The majority of the joints failed at the solder joint-chip pad interface. Only a small fraction of the joints developed cracks at the corners of the solder jointsubstrate interface. Microcracks occur at points of high localized stress and gradually spread by fracture of the material at the edges of Guo-Quan Lu, Xingsheng Liu, Sihua Wen, Jesus Noel Calata and John G.

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